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| TMS320LF2406PZA资料 | |
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TMS320LF2406PZA PDF Download |
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File Size : 116 KB
Manufacturer:TI Description:THERMAL PERFORMANCE The 24-lead SO package is a molded plastic package with a solid copper lead frame. Most of the heat generated at the die flows through the lead frame into the 3-ounce copper planes on the board. The board then acts as a heat sink. The junction-to-ambient thermal resistance of the packaged IC mounted on the board has been measured to be 38˚C/W, 37 ˚C/W, and 35 ˚C/W for the dissipation of 1.0W, 1.5W, and |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：TMS320LF2406PZA 厂 家：TI 封 装：08+ 批 号：QFP 数 量：3000 说 明： |
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运 费： 所在地： 新旧程度： |
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| 联系人：销售部 |
| 电 话：0755-82976789 |
| 手 机：13410176789 |
| QQ：461165269 |
| MSN：tongda-ic@hotmail.com |
| 传 真：0755-82975789 |
| EMail：kaihongyuan@126.com |
| 公司地址： 深圳市福田区中航路国利大厦1732-1733室/门市:深纺大厦C座804(有时价格未能及时更新,请联系确认当日价格) |
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